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Home CompaniesAmkor Technology Inc

Amkor Technology Inc

Technology Semiconductor Equipment & Materials
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Company price
36.9 USD -1.20 ( 3.15%)
Last update at 2026-11-12T15:50:00Z
VOLUME
657810
Market Cap
17398.83M
P/E
46.19

Momentum Score

…

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Source: TradingView
The charts and visual representations are sourced from TradingView through embedded widgets. For any issues with chart display, please visit the TradingView website

Day Price Range
36.16
Low
37.18
High
52 Week Price Range
16.35
Low
72.91
High

Momentum Score

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A unique technical analysis driven score developed by Kalkine showing momentum in stock prices based on select technical indicators identified.

Score - Rating
>= 1 - Low / > 1 but < 2 - Below Average / > 2 but < 3 - Average / > 3 but < 4 - Above Average / > 4 - High
AI Summary

Amkor Technology provides outsourced semiconductor packaging and test services worldwide, operating a global manufacturing footprint. Long-term growth may be supported by rising demand for advanced packaging formats such as system-in-package and heterogeneous integration across 5G, automotive and data-center applications, and the company’s scale in the OSAT market could appeal to investors.
Key investment risks include cyclical end-market demand, substantial capital expenditure needs, customer concentration and competitive and geopolitical pressures that investors should monitor.

Risk Score
Medium

Note: The summary and risk score provided above is created by AI and should not be construed as a recommendation of Kalkine.

Key Metrics*

Previous Close
38.10
Dividend Yield
0.48%
Revenue TTM
6707.98M
Revenue Per Share
27.15
Gross Profit TTM
938.60M
Debt / Equity
0.35
ROE
8.66%
Net Debt
187.14M
ROCE
8.10%
Diluted EPS TTM
1.52

Key Financials*

Income Statement

Balance Sheet

Change in Cash

Total Operating Cash

Dividends Paid

Breakdown 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Type yearly yearly yearly yearly yearly
Date 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Income before tax 444.62M 431.02M 443.84M 856.93M 715.07M
Minority interest -2.22M -1.52M -0.46M -1.22M -2.61M
Net income 373.89M 354.01M 359.81M 765.82M 643.00M
Selling general administrative 304.47M 331.81M 286.15M 283.37M 296.08M
Gross profit 938.60M 933.21M 943.15M 1329.99M 1225.55M
Reconciled depreciation 642.01M 594.66M 629.42M 612.70M 563.58M
Ebit 520.06M 495.96M 470.29M 897.19M 763.43M
Ebitda 1162.07M 1090.62M 470.29M 1528.20M 1330.16M
Depreciation and amortization 642.01M 594.66M 631.51M 631.01M 566.72M
Non operating income net other - - - 18.31M 3.14M
Operating income 467.38M 438.45M 470.29M 897.19M 763.43M
Other operating expenses 6240.60M 5879.24M 6032.78M 6194.40M 5374.90M
Interest expense 75.44M 64.94M 59.00M 58.56M 51.51M
Tax provision 68.50M 75.48M 94.92M 89.89M 69.46M
Interest income 62.40M 65.54M 40.77M 12.76M 1.06M
Net interest income -13.05M 0.60M -17.69M -58.56M -51.51M
Income tax expense 68.50M 75.48M 81.71M 89.89M 69.46M
Total revenue 6707.98M 6317.69M 6503.06M 7091.59M 6138.33M
Total operating expenses 471.21M 494.76M 472.87M 432.80M 462.12M
Cost of revenue 5769.38M 5384.48M 5559.91M 5761.60M 4912.77M
Total other income expense net -22.77M -7.44M -26.45M -40.25M -48.37M
Net income from continuing ops 376.12M 355.54M 407.01M 767.04M 645.61M
Net income applicable to common shares - - - 765.82M 643.00M
Breakdown 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Type yearly yearly yearly yearly yearly
Date 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Total assets 8136.31M 6944.33M 6771.12M 6821.76M 6038.55M
Other current assets 100.75M 61.01M 58.50M 65.12M 33.60M
Total liab 3630.02M 2761.16M 2776.09M 3122.06M 3066.01M
Total stockholder equity 4471.11M 4149.55M 3962.31M 3668.75M 2942.28M
Other current liab 613.64M 329.20M 335.90M 466.98M 516.03M
Common stock 0.29M 0.29M 0.29M 0.29M 0.29M
Capital stock 0.29M 0.29M 0.29M 0.29M 0.29M
Retained earnings 2627.04M 2335.13M 2159.83M 1874.64M 1163.94M
Other liab - - - 240.53M 317.35M
Good will 18.00M 17.95M 20.00M 21.52M 24.52M
Other assets - - - 192.22M 126.67M
Cash 1378.35M 1133.55M 1119.82M 959.07M 826.74M
Total current liabilities 1711.97M 1455.28M 1384.47M 1662.41M 1679.73M
Current deferred revenue - 59.66M 71.12M 81.46M 117.74M
Net debt 187.14M 347.02M 264.54M 420.00M 459.42M
Short term debt 185.57M 318.47M 223.00M 214.80M 217.24M
Short long term debt 162.43M 236.03M 131.62M 143.81M 153.01M
Short long term debt total 1565.48M 1480.57M 1384.36M 1379.07M 1286.17M
Other stockholder equity 1826.94M 1806.61M 1785.84M 1777.12M 1758.07M
Property plant equipment - - - 3306.78M 3030.80M
Total current assets 3884.76M 3073.47M 3195.81M 3301.24M 2856.56M
Net tangible assets - - - 3647.24M 2917.76M
Short term investments 613.04M 512.98M 474.87M 281.96M 251.53M
Net receivables 1354.83M 1055.01M 1149.49M 1365.50M 1258.77M
Long term debt 1282.82M 923.43M 1071.83M 1088.52M 984.99M
Inventory 437.80M 310.91M 393.13M 629.58M 484.96M
Accounts payable 912.77M 712.89M 754.45M 899.16M 828.73M
Noncontrolling interest in consolidated entity - - - 30.95M 30.27M
Accumulated other comprehensive income 16.83M 7.51M 16.35M 16.70M 19.98M
Common stock total equity - - - 0.29M 0.29M
Retained earnings total equity - - - 1874.64M 1163.94M
Treasury stock - - - - -219.06M
Non currrent assets other 201.51M 93.78M 64.48M 192.22M 126.67M
Non current assets total 4251.55M 3870.86M 3575.32M 3520.52M 3181.99M
Capital lease obligations 115.73M 140.42M 148.21M 146.74M 148.17M
Long term debt total - - - 1088.52M 984.99M
Breakdown 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Type yearly yearly yearly yearly yearly
Date 2025-12-31 2024-12-31 2023-12-31 2022-12-31 2021-12-31
Investments -97.10M -800.32M -980.85M -1007.17M -122.26M
Change to liabilities - - - 42.26M 343.46M
Total cashflows from investing activities -885.04M -800.32M -951.91M -1007.17M -943.88M
Net borrowings 196.59M -81.54M -72.23M 147.32M 12.17M
Total cash from financing activities 98.70M -260.43M -149.21M 55.60M -30.10M
Change to operating activities - - - -115.86M -124.35M
Net income 376.12M 355.54M 359.81M 767.04M 645.61M
Change in cash 311.81M 13.70M 158.21M 130.88M 129.32M
Begin period cash flow 1134.31M 1120.62M 962.41M 831.52M 702.20M
End period cash flow 1446.12M 1134.31M 1120.62M 962.41M 831.52M
Total cash from operating activities 1095.61M 1088.87M 1270.02M 1098.76M 1121.30M
Depreciation 642.01M 594.66M 631.51M 612.70M 563.58M
Other cashflows from investing activities 1.24M -31.40M -18.45M 6.16M -45.00M
Dividends paid 81.95M 178.60M 74.69M -55.12M -51.21M
Change to inventory -126.86M 78.97M 233.80M -148.14M -190.56M
Change to account receivables -296.82M 99.69M 205.49M -103.99M -298.85M
Sale purchase of stock - - - 5.63M -12.79M
Other cashflows from financing activities -15.95M -5.29M -5.86M 467.23M 378.05M
Change to netincome - - - -2.83M 39.07M
Capital expenditures 904.61M 743.80M 749.47M 908.29M 779.78M
Change receivables - - - -103.99M -298.85M
Cash flows other operating - - - -71.55M 21.59M
Cash and cash equivalents changes - - - 147.18M 147.31M
Change in working capital 115.03M 113.37M 236.73M -281.41M -124.35M
Stock based compensation 20.10M 18.37M 8.28M 13.56M 10.97M
Other non cash items -37.55M 7.72M 20.30M -1.52M 14.81M
Free cash flow 190.99M 345.07M 520.55M 190.46M 341.52M

Peer Comparison*

Sector: Technology Industry: Semiconductor Equipment & Materials

Stock Name
Change
(USD)
Price
(USD)
Trailing
PE (x)
Forward
PE (x)
Price Sales
TTM (x)
Price to Book Value (x)
Enterprise Value
to Revenue (x)
Enterprise Value
to EBITDA (x)
AMKR
Amkor Technology Inc		 -1.20
3.15%		 36.90 46.19 43.67 2.59 3.85 2.50 14.44
ASML
ASML Holding N.V. New York Registry Shares		 -14.12
0.92%		 1520.30 48.54 41.49 17.21 23.21 14.06 36.48
ASMLF
ASML Holding NV		 -19.87
1.29%		 1523.00 48.31 41.32 16.88 23.07 14.07 36.51
AMAT
Applied Materials Inc		 -11.68
2.96%		 383.40 40.44 36.23 11.09 14.41 11.04 30.52
TOELF
Tokyo Electron Ltd.		 -1.05
1.76%		 58.50 38.96 29.50 0.06 10.52 9.30 32.18

Profile*

Amkor Technology Inc

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

2045 East Innovation Circle, Tempe, AZ, United States, 85284

480 821 5000

https://amkor.com

30800

Name Title Year Born
Mr. James J. Kim Exec. Chairman 1936
Mr. Giel Rutten Pres, CEO & Director 1957
Ms. Susan Y. Kim Exec. Vice Chairman 1963
Ms. Megan Faust Exec. VP, CFO & Treasurer 1974
Mr. Mark N. Rogers Exec. VP, Gen. Counsel & Corp. Sec. 1966
Mr. Farshad Haghighi Exec. VP & Chief Sales Officer 1963
Ms. Jennifer Jue Sr. Director of Investor Relations and Fin. NA
Mr. Steve Shin Exec. VP of Worldwide Manufacturing 1963
Mr. Mike Liang Pres of Taiwan Operations NA
Mr. James J. Kim Executive Chairman of the Board 1936

Disclaimer - (*)This information, including any data, is sourced from Unicorn Data Services SAS, trading as EOD Historical Data (“EODHD”) on an ‘as is’ basis, using their API. We cannot guarantee the completeness or validity of the information and data provided on this page, as well as via the API. In some cases, the data may include analyst ratings or recommendations sourced through the EODHD API, which are intended solely for general information purposes.
This information does not consider your personal objectives, financial situation, or needs. Kalkine is not liable for any errors or omissions in the information provided or for any actions taken in reliance on it. You should seek advice from a financial adviser, stockbroker or other professional adviser (including taxation and legal advice) as necessary before acting on this information.

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