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Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; and VECTOR plasma-enhanced CVD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Vantex, a dielectric etch system that provides RF technology and repeatable wafer-to-wafer performance enabled by Equipment Intelligence solutions; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; and Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications. The company sells its products in the United States, China, Europe, Japan, Korea, Southeast Asia, and Taiwan. Lam Research Corporation was incorporated in 1980 and is headquartered in Fremont, California.
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| Breakdown | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 | 2019-06-30 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 | 2019-06-30 |
| Income before tax | 5109.21M | 5193.11M | 4370.80M | 2574.98M | 2446.57M |
| Net income | 4510.93M | 4605.29M | 3908.46M | 2251.75M | 2191.43M |
| Selling general administrative | 832.75M | 885.74M | 829.88M | 682.48M | 702.41M |
| Gross profit | 7776.93M | 7871.81M | 6805.31M | 4608.69M | 4358.46M |
| Reconciled depreciation | 342.43M | 333.74M | 307.15M | 268.52M | 309.28M |
| Ebit | 5259.16M | 5381.82M | 4482.02M | 2673.80M | 2464.73M |
| Ebitda | 5601.59M | 5715.56M | 4789.17M | 2942.33M | 2774.01M |
| Depreciation and amortization | 342.43M | 333.74M | 307.15M | 268.52M | 309.28M |
| Non operating income net other | -65.65M | -188.71M | -111.22M | -98.82M | -18.16M |
| Operating income | 5174.86M | 5381.82M | 4482.02M | 2673.80M | 2464.73M |
| Other operating expenses | 12211.51M | 11845.22M | 10144.13M | 7370.93M | 7188.83M |
| Interest expense | 186.46M | 184.76M | 208.60M | 177.44M | 117.26M |
| Tax provision | 598.28M | 587.83M | 462.35M | 323.23M | 255.14M |
| Interest income | 138.98M | 15.21M | 19.69M | 85.43M | 98.77M |
| Net interest income | -47.48M | -169.55M | -188.91M | -92.01M | -18.49M |
| Income tax expense | 598.28M | 587.83M | 462.35M | 323.23M | 255.14M |
| Total revenue | 17428.52M | 17227.04M | 14626.15M | 10044.74M | 9653.56M |
| Total operating expenses | 2559.91M | 2489.99M | 2323.28M | 1934.89M | 1893.73M |
| Cost of revenue | 9651.59M | 9355.23M | 7820.84M | 5436.04M | 5295.10M |
| Total other income expense net | -107.80M | -188.71M | -111.22M | -98.82M | -18.16M |
| Net income from continuing ops | 4510.93M | 4605.29M | 3908.46M | 2251.75M | 2191.43M |
| Net income applicable to common shares | 4510.93M | 4605.29M | 3908.46M | 2251.75M | 2191.43M |
| Breakdown | 2024-06-30 | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2024-06-30 | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 |
| Total assets | 18744.73M | 18781.64M | 17195.63M | 15892.15M | 14559.05M |
| Intangible assets | 138.54M | 168.45M | 101.85M | 132.37M | 168.53M |
| Other current assets | 298.19M | 214.15M | 347.39M | 207.53M | 146.16M |
| Total liab | 10205.27M | 10571.47M | 10917.27M | 9864.96M | 9375.56M |
| Total stockholder equity | 8539.45M | 8210.17M | 6278.37M | 6027.19M | 5183.49M |
| Deferred long term liab | - | 30.08M | - | - | - |
| Other current liab | 1801.88M | 4176.56M | 1974.27M | 1719.48M | 1272.65M |
| Common stock | 0.13M | 0.13M | 0.14M | 0.14M | 0.14M |
| Capital stock | 0.13M | 0.13M | 0.14M | 0.14M | 0.14M |
| Retained earnings | 24811.31M | 22032.10M | 18454.72M | 14684.91M | 11520.59M |
| Other liab | - | 1210.48M | 1354.06M | 1346.76M | 1129.37M |
| Good will | 1626.53M | 1622.49M | 1515.11M | 1622.50M | 1652.97M |
| Other assets | - | 1574.64M | 1645.85M | 1313.79M | 806.46M |
| Cash | 5847.86M | 5337.06M | 3522.00M | 4418.26M | 4915.17M |
| Total current liabilities | 4338.44M | 4184.92M | 4564.76M | 3527.87M | 3162.44M |
| Current deferred revenue | 1417.78M | -1011.21M | 1571.90M | 967.33M | 457.52M |
| Net debt | -864.52M | -325.51M | 1483.83M | 583.42M | 895.55M |
| Short term debt | 504.81M | 8.36M | 7.38M | 11.35M | 839.88M |
| Short long term debt | 501.32M | 8.36M | 7.38M | 11.35M | 836.11M |
| Short long term debt total | 4983.33M | 5011.54M | 5005.83M | 5001.68M | 5810.73M |
| Other stockholder equity | -16141.56M | -13721.35M | -12066.51M | -8593.74M | -6243.04M |
| Property plant equipment | - | 2099.33M | 1647.59M | 1303.48M | 1246.08M |
| Total current assets | 12883.22M | 13228.41M | 12285.24M | 11652.39M | 10853.53M |
| Net tangible assets | - | 6419.23M | 4661.40M | 4404.69M | 3519.53M |
| Short term investments | - | 37.64M | 135.73M | 1310.87M | 1795.08M |
| Net receivables | 2519.25M | 2823.38M | 4313.82M | 3026.43M | 2097.10M |
| Long term debt | 4466.05M | 5003.18M | 4998.45M | 4990.33M | 4959.37M |
| Inventory | 4217.92M | 4816.19M | 3966.29M | 2689.29M | 1900.02M |
| Accounts payable | 613.97M | 1011.21M | 1011.21M | 829.71M | 592.39M |
| Accumulated other comprehensive income | -130.43M | -100.71M | -109.98M | -64.13M | -94.21M |
| Common stock total equity | - | 0.13M | 0.14M | 0.14M | 0.14M |
| Retained earnings total equity | - | 22032.10M | 18454.72M | 14684.91M | 11520.59M |
| Treasury stock | - | - | -19481.43M | -15646.70M | -12949.89M |
| Non currrent assets other | 1941.92M | 1905.62M | 1645.85M | 1313.79M | 981.04M |
| Non current assets total | 5861.51M | 5553.23M | 4910.40M | 4239.77M | 3705.51M |
| Capital lease obligations | 15.97M | 46.60M | 43.37M | 40.75M | 15.25M |
| Long term debt total | - | 5003.18M | 4998.45M | 4990.33M | 4970.85M |
| Breakdown | 2024-06-30 | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 |
|---|---|---|---|---|---|
| Type | yearly | yearly | yearly | yearly | yearly |
| Date | 2024-06-30 | 2023-06-30 | 2022-06-30 | 2021-06-30 | 2020-06-30 |
| Investments | -370.61M | -534.56M | 1165.88M | 464.52M | -15.00M |
| Change to liabilities | - | -467.57M | 895.92M | 692.62M | 495.91M |
| Total cashflows from investing activities | - | -534.56M | 612.27M | 73.27M | -244.08M |
| Net borrowings | - | -23.21M | -11.89M | -862.06M | 1307.11M |
| Total cash from financing activities | -3995.85M | -2830.67M | -4578.94M | -4166.98M | -623.93M |
| Change to operating activities | - | 27.18M | -1796.23M | -678.74M | 196.88M |
| Net income | 3827.77M | 4510.93M | 4605.29M | 3908.46M | 2251.75M |
| Change in cash | 263.43M | 1813.84M | -897.22M | -498.33M | 1255.69M |
| Begin period cash flow | 5587.37M | 3773.53M | 4670.75M | 5169.08M | 3913.40M |
| End period cash flow | 5850.80M | 5587.37M | 3773.53M | 4670.75M | 5169.08M |
| Total cash from operating activities | 4652.27M | 5178.94M | 3099.67M | 3588.16M | 2126.45M |
| Issuance of capital stock | 15.55M | 11.11M | 5.68M | 24.12M | 8.08M |
| Depreciation | 359.70M | 342.43M | 333.74M | 307.15M | 268.52M |
| Other cashflows from investing activities | -11.71M | -131.13M | -7.58M | -42.16M | -25.84M |
| Dividends paid | 1018.91M | 907.91M | 815.29M | 726.99M | 656.84M |
| Change to inventory | 528.72M | -961.97M | -1351.34M | -792.59M | -411.61M |
| Change to account receivables | 303.44M | 1452.26M | -1287.68M | -928.93M | -641.83M |
| Sale purchase of stock | -2842.81M | -2017.01M | -3865.66M | -2697.70M | -1369.65M |
| Other cashflows from financing activities | 106.42M | 106.35M | 108.22M | 95.65M | 3312.01M |
| Change to netincome | - | 166.84M | -43.12M | 51.30M | 172.11M |
| Capital expenditures | 396.67M | 501.57M | 546.03M | 349.10M | 203.24M |
| Change receivables | - | 1452.26M | -1287.68M | -928.93M | -641.83M |
| Cash flows other operating | - | 136.02M | -53.12M | -59.19M | -14.35M |
| Exchange rate changes | - | - | - | 7.21M | -2.75M |
| Cash and cash equivalents changes | - | 1813.71M | -866.99M | -498.33M | 1255.69M |
| Change in working capital | 360.48M | 158.74M | -1796.23M | -678.74M | -571.88M |
| Stock based compensation | 293.06M | 286.60M | 259.06M | 220.16M | 189.20M |
| Other non cash items | 10.24M | 52.30M | -44.75M | -17.39M | 6.63M |
| Free cash flow | 4255.60M | 4677.37M | 2553.64M | 3239.07M | 1923.21M |
Sector: Technology Industry: Semiconductor Equipment & Materials
|
Stock Name
|
Change
(USD) |
Price
(USD) |
Trailing
PE (x) |
Forward
PE (x) |
Price Sales
TTM (x) |
Price to Book Value (x)
|
Enterprise Value
to Revenue (x) |
Enterprise Value
to EBITDA (x) |
|---|---|---|---|---|---|---|---|---|
| LRCX Lam Research Corp |
14.81 8.00% |
200.01 | 26.38 | 21.79 | 6.73 | 12.20 | 6.56 | 19.75 |
| ASML ASML Holding N.V. New York Registry Shares |
68.10 5.02% |
1424.75 | 48.54 | 41.49 | 17.21 | 23.21 | 14.06 | 36.48 |
| ASMLF ASML Holding NV |
59.23 4.36% |
1417.90 | 48.31 | 41.32 | 16.88 | 23.07 | 14.07 | 36.51 |
| AMAT Applied Materials Inc |
15.13 4.74% |
334.38 | 40.44 | 36.23 | 11.09 | 14.41 | 11.04 | 30.52 |
| TOELF Tokyo Electron Ltd. |
4.91 9.92% |
54.43 | 38.96 | 29.50 | 0.06 | 10.52 | 9.30 | 32.18 |
Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; and VECTOR plasma-enhanced CVD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Vantex, a dielectric etch system that provides RF technology and repeatable wafer-to-wafer performance enabled by Equipment Intelligence solutions; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; and Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications. The company sells its products in the United States, China, Europe, Japan, Korea, Southeast Asia, and Taiwan. Lam Research Corporation was incorporated in 1980 and is headquartered in Fremont, California.
4650 Cushing Parkway, Fremont, CA, United States, 94538
510 572 0200
17700
| Name | Title | Year Born |
|---|---|---|
| Mr. Timothy M. Archer | Pres, CEO & Director | 1967 |
| Mr. Douglas R. Bettinger | Exec. VP, CFO & Chief Accounting Officer | 1967 |
| Dr. Patrick J. Lord Ph.D. | Exec. VP of Customer Support Bus. Group & Global Operations | 1966 |
| Mr. Vahid Vahedi | Sr. VP & GM of the Etch Bus. Unit | 1966 |
| Mr. Seshasayee Varadarajan | Sr. VP & GM of Deposition Bus. Unit | 1975 |
| Dr. Richard A. Gottscho | Exec. VP & CTO | 1952 |
| Mr. Robert F. Hawthorne | Chief Information Officer | NA |
| Ms. Tina Correia | Corp. VP of Investor Relations & Corp. Fin. | NA |
| Ms. Ava M. Hahn J.D. | Sr. VP, Chief Legal Officer & Sec. | 1973 |
| Ms. Stacey MacNeil | Chief Communications Officer | NA |
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